Park, Jongwoo: search on Z-Library

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1

[IEEE 2015 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2015.4.19-2015.4.23)] 2015 IEEE International Reliability Physics Symposium - Systematical study of 14nm FinFET reliability: From device level stress to product HTOL

Liu, Changze, Sagong, Hyun-Chul, Kim, Hyejin, Choo, Seungjin, Lee, Hyunwoo, Kim, Yoohwan, Kim, Hyunjin, Jo, Bisung, Jin, Minjung, Kim, Jinjoo, Ha, Sangsu, Pae, Sangwoo, Park, Jongwoo

Year:

2015

Language:

english

File:

PDF, 504 KB

english, 2015

2

[IEEE 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Saratoga Springs, NY, USA (2020.8.24-2020.8.26)] 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Particle Defect Reduction Through YF 3 Coated Remote Plasma Source for High Throughput Dry Cleaning Process

Seo, Hyojeong, Yang, Jeonghye, Ma, Young Jae, Park, Jongwoo, Kim, Mi Kyoung, Seo, David H., Yoon, Sung Jin, Park, Sang Jong

Year:

2020

File:

PDF, 246 KB

2020

3

A Multiagent Approach to Q-Learning for Daily Stock Trading

Jae Won Lee, Jonghun Park, Jangmin O, Jongwoo Lee, Euyseok Hong

Journal:

IEEE Transactions on Systems Man and Cybernetics - Part A Systems and Humans

Year:

2007

Language:

english

File:

PDF, 1.11 MB

english, 2007

4

Six-Axis Force/Torque Fingertip Sensor for an Anthropomorphic Robot Hand

Kim, Uikyum, Jeong, Heeyeon, Do, Hyunmin, Park, Jongwoo, Park, Chanhun

Journal:

IEEE Robotics and Automation Letters

Year:

2020

File:

PDF, 3.16 MB

2020

5

[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Set level at speed HTOL test for reliability qualification of high speed mobile applications

Park, Jongwoo, Wooyeon Kim,, Taeyong Lee,, Donghee Lee,, Jeongsik Lim,, Jiheon Jeong,, Yunhwan Kim,, Lee, Kyongtaek, Joungsu Ryu,, Sang-Chul Shin,, Hyunjo Shin,, Sangwoo Pae,

Year:

2014

Language:

english

File:

PDF, 1.01 MB

english, 2014

6

[IEEE 2020 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2020.2.16-2020.2.20)] 2020 IEEE International Solid- State Circuits Conference - (ISSCC) - 11.7 A Voltage-Tolerant Three-Level Buck-Boost DC-DC Converter with Continuous Transfer Current and Flying Capacitor Soft Charger Achieving 96.8% Power Efficiency and 0.87Âµs/V DVS Rate

Baek, Jongbeom, Nomiyama, Takahiro, Park, Seungchan, Jung, Young-Ho, Kim, Dongsu, Han, Jaeyeol, Bang, Jun-Suk, Lee, Yumi, Kim, Ik-Hwan, Paek, Ji-Seon, Lee, Jongwoo, Cho, Thomas Byunghak

Year:

2020

File:

PDF, 997 KB

2020

7

[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - TC degradation and root-cause analysis of SACVD BPSG film for robust IC fabrication

Park, Jongwoo, Lee, Miji, Kang, Han Byul, Lee, Dong Keun, Kim, Jung Dong, Pae, Sangwoo

Year:

2015

Language:

english

File:

PDF, 514 KB

english, 2015

8

[IEEE 2020 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2020.2.16-2020.2.20)] 2020 IEEE International Solid- State Circuits Conference - (ISSCC) - 13.2 A 1Tb 4b/Cell 96-Stacked-WL 3D NAND Flash Memory with 30MB/s Program Throughput Using Peripheral Circuit Under Memory Cell Array Technique

Huh, Hwang, Cho, Wanik, Lee, Jinhaeng, Noh, Yujong, Park, Yongsoon, Ok, Sunghwa, Kim, Jongwoo, Cho, Kayoung, Lee, Hyunchul, Kim, Geonu, Park, Kangwoo, Kim, Kwanho, Lee, Heejoo, Chai, Sooyeol, Kwon, Ch

Year:

2020

File:

PDF, 322 KB

2020

9

Degradation of fiber optical communication devices under damp-heat aging

Jongwoo Park, Shin, D.S.

Journal:

IEEE Photonics Technology Letters

Year:

2003

Language:

english

File:

PDF, 224 KB

english, 2003

10

Interfacial Degradation Mechanism of Au/Al and Alloy/Al Bonds Under High Temperature Storage Test: Contamination, Epoxy Molding Compound, Wire and Bonding Strength

Jongwoo Park, Hyun-Joon Cha, Back-Sung Kim, Yong-Bum Jo, June-Kyun Park, Sam-Young Kim, Sang-Cheol Shin, Man-Young Shin, Kyung-Il Ouh, Hyungoo Jeon

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 4.68 MB

english, 2007

11

Ultrasound-guided selective nerve root block versus fluoroscopy-guided transforaminal block for the treatment of radicular pain in the lower cervical spine: A randomized, blinded, controlled study

Haemi Jee, Ji Hae Lee, Jongwoo Kim, Ki Deok Park, Woo Yong Lee…

Journal:

Skeletal Radiology

Year:

2013

Language:

english

File:

PDF, 344 KB

english, 2013

12

Characterization of interfacial adhesion damage induced by accelerated life testing

Jongwoo Park,, Harlow, D.G., Nied, H.F.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2000

Language:

english

File:

PDF, 614 KB

english, 2000

13

[IEEE 2016 IEEE International Reliability Physics Symposium (IRPS) - Pasadena, CA, USA (2016.4.17-2016.4.21)] 2016 IEEE International Reliability Physics Symposium (IRPS) - Scenario-based set-level HTOL test (ASH III) for product quality and reliability qualifications on high-speed APs

Park, Jongwoo, Kim, Jeonghoon, Choe, Minhyeok, Shim, Hyewon, Kim, Wooyeon, Park, Sangmin, Shin, Sangchul, Kim, Yunwhan, Jeong, Jiheon, Shin, Hyunjo, Lee, Haebum, Pae, Sangwoo

Year:

2016

Language:

english

File:

PDF, 486 KB

english, 2016

14

A system for rapid design and manufacturing of custom-tailored shoes

Sangkun Park, Kunwoo Lee, Jongwon Kim, Jongwoo Park

Journal:

Journal of Mechanical Science and Technology

Year:

2000

Language:

english

File:

PDF, 1.71 MB

english, 2000

15

[IEEE 2013 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA (2013.4.14-2013.4.18)] 2013 IEEE International Reliability Physics Symposium (IRPS) - At speed HTOL test for reliability qualification of high speed mobile applications

Jongwoo Park,, Da Ahn,, Donghee Lee,, Jang, E.-S, Wooyeon Kim,, Sangchul Shin,, Gunrae Kim,, Nae-In Lee,, Sangwoo Pae,

Year:

2013

Language:

english

File:

PDF, 956 KB

english, 2013

16

[IEEE 2013 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA (2013.4.14-2013.4.18)] 2013 IEEE International Reliability Physics Symposium (IRPS) - Technology scaling on High-K & Metal-Gate FinFET BTI reliability

Kyong Taek Lee,, Wonchang Kang,, Eun-Ae Chung,, Gunrae Kim,, Hyewon Shim,, Hyunwoo Lee,, Hyejin Kim,, Minhyeok Choe,, Nae-In Lee,, Patel, Anuj, Junekyun Park,, Jongwoo Park,

Year:

2013

Language:

english

File:

PDF, 352 KB

english, 2013

17

To Tell or Not to Tell

Wiles, Lynn L., Park, Eun Hee (Eunice), Kim, Jongwoo (Jonathan)

Journal:

CIN Computers Informatics Nursing

Year:

2018

Language:

english

File:

PDF, 111 KB

english, 2018

18

[IEEE TENCON 2018 - 2018 IEEE Region 10 Conference - Jeju, Korea (South) (2018.10.28-2018.10.31)] TENCON 2018 - 2018 IEEE Region 10 Conference - Prediction of Daily Mental Stress Levels Using a Wearable Photoplethysmography Sensor

Park, Jongwoo, Kim, Jongsu, Kim, Sung-Phil

Year:

2018

Language:

english

File:

PDF, 606 KB

english, 2018

19

Green-Light-Activated Photoreaction via Genetic Hybridization of Far-Red Fluorescent Protein and Silk

Leem, Jung Woo, Park, Jongwoo, Kim, Seong-Wan, Kim, Seong-Ryul, Choi, Seung Ho, Choi, Kwang-Ho, Kim, Young L.

Journal:

Advanced Science

Year:

2018

Language:

english

File:

PDF, 2.05 MB

english, 2018

20

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Wavelength stability of DFB lasers for non-hermetic applications

Theis, C., Jongwoo Park,, Kiely, P., Tohmon, G., Ping Wu,, Chakrabarti, U., Osenbach, J.

Year:

2001

Language:

english

File:

PDF, 988 KB

english, 2001

21

[IEEE 2015 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2015.4.19-2015.4.23)] 2015 IEEE International Reliability Physics Symposium - SRAM stability design comprehending 14nm FinFET reliability

Bae, Choelhwyi, Pae, Sangwoo, Yu, Cheong-sik, Kim, Kangjung, Kim, Yongshik, Park, Jongwoo

Year:

2015

Language:

english

File:

PDF, 846 KB

english, 2015

22

Effects of Ultrasound-guided intra-articular ketorolac injection with capsular distension

Ahn, Jae Ki, Kim, Jongwoo, Lee, Sang Jae, Park, Yongbum, Bae, Byung, Lee, Woo

Journal:

Journal of Back and Musculoskeletal Rehabilitation

Year:

2015

Language:

english

File:

PDF, 361 KB

english, 2015

23

Nanofocusing of Toroidal Dipole for Simultaneously Enhanced Electric and Magnetic Fields using Plasmonic Waveguide

Kim, Sun-Je, Mun, Sang-Eun, Lee, Yohan, Park, Hyeonsoo, Hong, Jongwoo, Lee, Byoungho

Journal:

Journal of Lightwave Technology

Year:

2018

Language:

english

File:

PDF, 997 KB

english, 2018

24

Effect of fluoroethylene carbonate on electrochemical battery performance and the surface chemistry of amorphous MoO2 lithium-ion secondary battery negative electrodes

Park, Jongwoo, Choi, Insoo, Lee, Min Jeong, Kim, Myeong Ho, Lim, Taeho, Park, Kern H., Jang, Jihyun, Oh, Seung M., Cho, Sung Ki, Kim, Jae Jeong

Journal:

Electrochimica Acta

Year:

2014

Language:

english

File:

PDF, 4.48 MB

english, 2014

25

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Electromagnetic interference (EMI) behavior of system in package ( SIP)

Seung-Bae Lee,, Jongwoo Park,, Sang-Jun Hong,, Hyun-Goo Jeon,

Year:

2004

Language:

english

File:

PDF, 549 KB

english, 2004

26

[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Systematic reliability characterizations on Average Output Voltage (AVO) shift of Display Driver IC by HTOL

Jungdong Kim,, Donghun Kim,, Minhyeok Choe,, Kidan Bae,, Sangchul Shin,, Sangwoo Pae,, Park, Jongwoo

Year:

2014

Language:

english

File:

PDF, 334 KB

english, 2014

27

All-Inkjet-Printed Flexible Piezoelectric Generator made of Solvent Evaporation Assisted BaTiO 3 Hybrid Material

Lim, Jongwoo, Jung, Hyunsung, Baek, Changyeon, Hwang, Geon-Tae, Ryu, Jungho, Yoon, Daeho, Yoo, Jibeom, Park, Kwi-Il, Kim, Jong Hee

Journal:

Year:

2017

Language:

english

File:

PDF, 1.73 MB

english, 2017

28

Stress Evolution Related to Metal Routing in Submicron Multilevel Interconnects: Void and Extrusion

Yong-Bum Jo,, Jongwoo Park,, June-Kyun Park,, Kyung-Il Ouh,, Hyun-Goo Jeon,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 2.60 MB

english, 2007

29

[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Phase transformation of programmed NiSi electrical fuse: Diffusion, agglomeration and thermal stability

Park, Jongwoo, Kang, Han-Byul, Gun-Rae Kim,, Min Kim,

Year:

2011

Language:

english

File:

PDF, 4.52 MB

english, 2011

30

A model of emotion and computer abuse

Kim, Jongwoo (Jonathan), Park, Eun Hee (Eunice), Baskerville, Richard L.

Journal:

Information & Management

Year:

2016

Language:

english

File:

PDF, 973 KB

english, 2016

31

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Two-Phase Flow Simulation of Molded Underfill Process to Mitigate Void and Assure Reliability at Product Level

Choi, Kwang Won, Baick, In Hak, Lee, Donghwan, Lee, Eunjung, Kwon, Eunmi, Pae, Sangwoo, Park, Jongwoo

Year:

2016

Language:

english

File:

PDF, 713 KB

english, 2016

32

The role of information security learning and individual factors in disclosing patients' health information

Park, Eun Hee, Kim, Jongwoo, Park, Young Soon

Journal:

Computers & Security

Year:

2017

Language:

english

File:

PDF, 644 KB

english, 2017

33

Cooperative bimetallic catalysis in asymmetric transformations

Park, Jongwoo, Hong, Sukwon

Journal:

Chemical Society Reviews

Year:

2012

Language:

english

File:

PDF, 4.03 MB

english, 2012

34

Critical aspect of curing epoxy adhesive: fiber pistoning of LC connector

Jongwoo Park,, Shin, D.-S., Delucca, J., Theis, C., Osenbach, J.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2005

Language:

english

File:

PDF, 426 KB

english, 2005

35

Establishing Upper Bounds on CO2 Swing Capacity in Sub-Ambient Pressure Swing Adsorption via Molecular Simulation of Metal-Organic Frameworks

Sholl, David, Lively, Ryan, Park, Jongwoo

Journal:

Journal of Materials Chemistry A

Year:

2017

Language:

english

File:

PDF, 2.43 MB

english, 2017

36

[IEEE 2015 International Conference on Information and Communication Technology Convergence (ICTC) - Jeju Island, South Korea (2015.10.28-2015.10.30)] 2015 International Conference on Information and Communication Technology Convergence (ICTC) - Design and implementation of touch-link algorithm for reducing the link connection time in ZigBee

Sung, Jung-Sik, Park, Seonghee, Kang, Tae-Gyu, Choi, Jongwoo

Year:

2015

Language:

english

File:

PDF, 928 KB

english, 2015

37

83â2: Reliability Characterization of Luminance Degradation of OLED Mobile Display Considering Color Difference Index Based on Usage Patterns

Kim, Heejin, Choi, Yoonsuk, Kim, Sangkil, Chung, Sam, Park, Jongwoo

Journal:

SID Symposium Digest of Technical Papers

Year:

2020

File:

PDF, 771 KB

2020

38

Novel power control and collision resolution schemes for device-to-device discovery

Hong, Jongwoo, Park, Seungil, Choi, Sunghyun

Journal:

Peer-to-Peer Networking and Applications

Year:

2016

Language:

english

File:

PDF, 1.86 MB

english, 2016

39

[IEEE 2010 IEEE International Reliability Physics Symposium - Garden Grove (Anaheim), CA, USA (2010.05.2-2010.05.6)] 2010 IEEE International Reliability Physics Symposium - Electromigration of NiSi poly gated electrical fuse and its resistance behaviors induced by high temperature

Han-Byul Kang,, Jongwoo Park,, Gun-Rae Kim,, Hyun-Woo Park,, Woon-Hak Lee,, Joo-Byoung Yoon,

Year:

2010

Language:

english

File:

PDF, 1.51 MB

english, 2010

40

Pâ3: Effects of Negative Bias Illumination Stress on IGZO Device and Luminance Behaviors in OLED Display Panel Operated by AC Conditions

Im, Kiju, Kim, Hyojung, Hwang, Hyuncheol, Kim, Junehwan, Khim, Taeyoung, Chung, Sam, Park, Jongwoo

Journal:

SID Symposium Digest of Technical Papers

Year:

2020

File:

PDF, 710 KB

2020

41

An analysis of the effects of osmotic backwashing on the seawater reverse osmosis process

Park, JunYoung, Jeong, WooWon, Nam, JongWoo, Kim, JaeHun, Kim, JiHoon, Chon, Kangmin, Lee, Euijong, Kim, HyungSoo, Jang, Am

Journal:

Environmental Technology

Year:

2014

Language:

english

File:

PDF, 431 KB

english, 2014

42

Microstructure of interfacial reaction layer in Sn–Ag–Cu/electroless Ni (P) solder joint

Han-Byul Kang, Jee-Hwan Bae, Jeong-Won Yoon, Seung-Boo Jung, Jongwoo Park, Cheol-Woong Yang

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2011

Language:

english

File:

PDF, 388 KB

english, 2011

43

Porous Silica Particles as Oil Absorbents: Comparison of Meso-, Macro-, and Meso/Macro-Structures

Kim, Kwang-Dae, Cho, Youn Kyoung, Han, Sang Wook, Park, Eun Ji, Kim, Dae Han, Jeong, Myung-Geun, Kim, Young Dok, Moon, Jongwoo, Hong, Eunmi, Lim, Dong Chan

Journal:

Bulletin of the Korean Chemical Society

Year:

2015

Language:

english

File:

PDF, 850 KB

english, 2015

44

Self-Assembly Approach toward Chiral Bimetallic Catalysts: Bis-Urea-Functionalized (Salen)Cobalt Complexes for the Hydrolytic Kinetic Resolution of Epoxides

Jongwoo Park, Kai Lang, Dr. Khalil A. Abboud, Prof. Dr. Sukwon Hong

Journal:

Chemistry - A European Journal

Year:

2011

Language:

english

File:

PDF, 565 KB

english, 2011

45

Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging

Jongwoo Park, John Osenbach

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 370 KB

english, 2006

46

Effectual Labeling of Natural Killer Cells with Upconverting Nanoparticles by Electroporation for In Vivo Tracking and Biodistribution Assessment

Park, Hye Sun, Kim, Jongwoo, Cho, Mi Young, Cho, Youn-Joo, Suh, Yung Doug, Nam, Sang Hwan, Hong, Kwan Soo

Journal:

ACS Applied Materials & Interfaces

Year:

2020

File:

PDF, 7.67 MB

2020

47

Interfacial degradation of epoxy coated silicon nitride

Jongwoo Park,, Harlow, D.G.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 830 KB

english, 2002

48

[IEEE 2016 IEEE International Reliability Physics Symposium (IRPS) - Pasadena, CA, USA (2016.4.17-2016.4.21)] 2016 IEEE International Reliability Physics Symposium (IRPS) - Hot carrier reliability characterization in consideration of self-heating in FinFET technology

Jin, Minjung, Liu, Changze, Kim, Jinju, Kim, Jungin, Choo, Seungjin, Kim, Yoohwan, Shim, Hyewon, Zhang, Lijie, Nam, Kab-jin, Park, Jongwoo, Pae, Sangwoo, Lee, Haebum

Year:

2016

Language:

english

File:

PDF, 361 KB

english, 2016

49

An emote opportunity model of computer abuse

Baskerville, Richard, Hee Park, Eun, Kim, Jongwoo

Journal:

Information Technology & People

Year:

2014

Language:

english

File:

PDF, 812 KB

english, 2014

50

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Epoxy adhesive used in optical fiber/passive component: kinetics, voids and reliability

Jongwoo Park,, Taweeplengsangsuke, J., Theis, C., Osenbach, J.

Year:

2001

Language:

english

File:

PDF, 600 KB

english, 2001

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